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Medical
TECHNICAL SITUATION
In order to implement all the functions required by the device and still meet the fit and form objectives, the system was envisioned as a multi-board solution. Stacked mixed signal boards with distributed processing capabilities and connecting through multiple small-pitch connectors had to be designed and manufactured. Both analog and digital circuitry had to be placed on the boards, increasing design complexity.
SOLUTION:
The solution used an embedded dual-core processor and a large capacity CPLD and included dedicated peripherals such as USB, touch screen, and ultrasound sensors. It involved the integration of high speed digital design, complex analog circuitry, and the manufacturing of the high density modules. Each subsystem contained between 300-400 part parts, all packed in two boards no larger that a cell phone. In order to achieve this density, the design was implemented using micro-BGA technology, an 8 layer boards with line traces down to 3mils, and micro-vias. Electromechanical verification was performed by generating accurate 3D models of the boards and multi-board integration of these models. Readix engineering teams worked closely with manufacturing partners to optimize manufacturing processes and costs. The solution was delivered on time and on budget and Pocketsonics™ had their product ready for marketing.
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